Development of Origami-Inspired Folding Microactuators

Forschungsthema/Bereich

Microsystem Engineering, Mechanical Engineering, Material Science, Mechatronics, Actuator Technology, Cooperative Systems

Typ der Abschlussarbeit

Bachelor / Master

Startzeitpunkt

01.03.2025

Bewerbungsschluss

01.05.2025

Dauer der Arbeit

3-6 Months

Beschreibung

Within the framework of a Priority Program of the German Science Foundation (DFG), a novel concept of shape memory alloy (SMA) folding microactuators is developed following the concept of the ancient art of Origami. Thus, adaptive 3D microstructures can be generated by active folding miniature-scale rigid tiles out-of-plane to enable promising future applications in minimal-invasive surgery, micro-assembly, and micro-robotics.

As part of the student’s thesis, a demonstrator consisting of SMA folding microactuators with multiple tiles is to be developed, fabricated, and characterized thermally, electrically and mechanically. This research builds on existing know-how on device engineering and microfabrication technology of previous SMA microactuators developed at IMT-KIT. The focus of this work can be adapted to the student's abilities and interests.

The thesis can be written in German or English.

Potential focus topic(s):
• Electro-thermal optimization of Origami-inspired microactuators (Geometry studies, FEM multiphysics simulation)
• Microtechnology fabrication of Origami-inspired microactuators (IMT cleanroom technologies, Optical lithography, Two-Photon 3D lithography, Laser technology)
• Characterization of Origami-inspired microactuators (thermo-mechanical, electrical properties)

Voraussetzung

Voraussetzungen an Studierende

• Good knowledge in actuator technology, microfabrication technologies, CAD, FEM simulation is beneficial
• Ambitious, curious, good team player, able to work independently and self-motivated

Studiengangsbereiche

• Ingenieurwissenschaften
  Elektrotechnik & Informationstechnik
  Maschinenbau
  Materialwissenschaft & Werkstofftechnik
  Mechatronik & Informationstechnik
  Mechanical Engineering
• Naturwissenschaften und Technik
  Medizintechnik

Betreuung

Titel, Vorname, Name

M. Sc. Vincent Gottwald

Organisationseinheit

Institute of Microstructure Technology

E-Mail Adresse

vincent.gottwald@kit.edu

Link zur eigenen Homepage/Personenseite

Website

Bewerbung per E-Mail

Bewerbungsunterlagen

E-Mail Adresse für die Bewerbung
Senden Sie die oben genannten Bewerbungsunterlagen bitte per Mail an vincent.gottwald@kit.edu


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