Miniature scale cooling device using shape memory smart materials

Forschungsthema/Bereich

Mechanical engineering, electrical engineering, physics and related programs of study

Typ der Abschlussarbeit

Bachelor / Master

Startzeitpunkt

01.04.2025

Bewerbungsschluss

30.12.2025

Dauer der Arbeit

6 Months

Beschreibung

In Germany, refrigeration accounts for 14% of electricity consumption. Cooling on a small scale, as it is required, e.g., in electronic chips, lab-on-chip systems, chemical and biological analysis, is often performed by miniaturization-compatible thermoelectric cooling, which is however rather in-efficient.

The search for energy-efficient, ’green’ alternatives has recently lead to increased interest in solid-state cooling based on caloric effects. Among these, the elastocaloric effect in shape memory alloys exhibits particularly high temperature changes and material-level coefficients of performance (COP) exceeding 80% of the thermodynamic maximum. Shape memory alloys belong to the class of smart materials showing heat absorption, heat generation, actuation and sensing. The goal will be to explore the potential of the elastocaloric effect in these materials for small-scale or ’microcooling’ applications, making use of shape memory films. Although this thesis is targeted at miniature scale cooling, it may also be used for larger scales in parallel architectures.

To carry out the work, the IMT has extensive state-of-the-art equipment (600 m² clean room, rapid prototyping processes such as 3D printing and laser cutting, assembly and joining technology laboratories, various metrological laboratories). Intensive support ensures that the work can be carried out within the given time frame.

Voraussetzung

Voraussetzungen an Studierende

• Your Tasks:
• • Characterization of the elastocaloric effect in SMA film materials
• • Modelling (Matlab, Simscape) and design
• • Prototype development: Fabrication, performance tests, characterization

Studiengangsbereiche

• Ingenieurwissenschaften
  Elektrotechnik & Informationstechnik
  Maschinenbau
  Energy Engineering and Management
• Naturwissenschaften und Technik
  Physik

Betreuung

Titel, Vorname, Name

Jingyuan Xu

Organisationseinheit

Institute of Microstructure Technology, IMT

E-Mail Adresse

jingyuan.xu@kit.edu

Link zur eigenen Homepage/Personenseite

Website

Bewerbung per E-Mail

Bewerbungsunterlagen

• Anschreiben
• Lebenslauf

E-Mail Adresse für die Bewerbung
Senden Sie die oben genannten Bewerbungsunterlagen bitte per Mail an jingyuan.xu@kit.edu


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